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TR7600 SII Automated X-ray Inspection (AXI)

INTRODUCTION

Featuring advanced automated 3D X-ray inspection of PCBAs, the TR7600 SII high speed scanning with multiple resolutions in a single program. Automatic Pass/Fail determination uses 2D + 3D images provided using 6-axis control and ultra-high-speed multiple angle cameras with automatic board warp compensation. TR7600 SII is ideal for inspection of fine pitch 01005 components, μBGAs, 2/3-layer PoPs, LGAs and other bottom termination components on both sides of the PCBA, including complex Pressfit connectors.

AXI Key Features

  • High speed cameras – 3x faster inspection speed than TR7600
  • X-ray tube with adjustable output up to 130 kV/300 µA
  • Block scan for selective scanning of components in higher resolutions
  • Multiple angle cameras for 2D + 3D slice images using Digital Tomosynthesis
  • Exclusive Image enhancement technology for clear Pressfit inspection Rapid Programming Interface with Auto Library and Offline Editing Precision
  • Height Repeatability
  • Calibration target (at 3σ) < 1% on TRI certification target
  • Solder GR&R (± 50% Tolerance) <<10% at 6σ
  • Inline 3D Automated X-ray Inspection
  • Fast Inline Automated X-ray Inspection of PCBA
  • 2D + 3D Images using multiple angled cameras
  • Automated Inspection and Pass/Fail Evaluation
  • User selectable X-ray power up to 130 kV/ 300 μA
  • Patented 6-axis motion control for maximum flexibility
  • Large board inspection up to 900 x 460 mm
  • Intelligent Software Solution
  • Automated CAD-based or Manual programming
  • Intelligent detection of solder and assembly defects
  • Automatic Image quality enhancement for overlapping components and complex defects
  • Automatic board warp compensation
  • Automated 3D Slice Extraction

"3D" CT Features

  • High-speed Inline 3D X-ray Inspection
  • Planar CT Imaging Upgrade for True 3D Solder Review
  • Block scan for selective scanning of components in higher resolutions
  • High Resolution Mode for 01005 Components
  • BGA, 3-layer PoP, Press-t, PTH, LGA & QFN Voiding
  • Multiple Resolutions in One Program
  • BlockScan 3D Slice Imaging

Block Scan

Block Scan module enhances AXI test program coverage by re-scanning selected areas of the tested board using customized system settings. This improves image quality and automated defect detection for most complex PCBAs, including fine pitch μBGAs, Press Fit and metal shielded components. Using Block Scan, TRI AXI can reliably inspect up to 3-layer PoP packages.