TR7600 F3D SII
The TR7600F3D SII is the Next-generation High-Speed In-line Automated X-Ray Inspection Solution, soaring speeds as to twice to three times as fast as the previous model. The AXI solution can inspect large boards, up to 900 mm x 460 mm. The TR7600F3D SII lowers the escapes and false calls without compromising the production line's cycle time.
- 5 µm High Precision for Comprehensive Defect Detection
- Next Generation Mechanical Design for Higher Speed up to 10 FOV/s
- Smart Factory Ready with Easy MES Connectivity
Imaging System
| Camera | Flat Panel Detector |
| X-ray Source | 130 kV Max (User Adjustable) |
| Imaging Resolution | 5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm (Choose 3 Resolutions) |
| Inspection Method | 2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
| X-Axis Control | High-Precision Ballscrew + AC-Servo Controller |
| Y-Axis Control | High-Precision Ballscrew + AC-Servo Controller |
| Z-Axis Control | High-Precision Ballscrew + AC-Servo Controller |
| X-Y Axis Resolution | N/A |
Board Handling
| Max PCB Size |
900 x 460 mm* * The Max. PCB Size will vary depending on the angle of incidence |
| PCB Thickness | 0.6 - 7 mm |
| Max PCB Weight | 12 kg |
| Top Clearance |
@ 20/25/30 μm: 50 mm @ 15 μm: 45 mm @ 10 μm: 25 mm @ 5 μm: 5 mm |
| Bottom Clearance |
@ 30 μm: 55 mm @ 5/10/15/20/25 μm: 70 mm |
| Edge Clearance | 3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm * SMEMA Compatible |
Inspection Functions
| Component |
Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
| Solder |
Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
Dimensions
| WxDxH |
1470 x 1971 x 1974 mm Note: not including signal tower, height: 510 mm |
| Weight | 3850 kg |
| Power Requirement | 200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
