TR7007 D Plus
The TR7007 SII Ultra performs at an industry-leading speed of up to 180 cm2/sec. The TR7007 SII Ultra is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.
- Industry-leading inspection speed up to 180 cm2/sec
- Ready to Inspect in Minutes with TRI's Smart Programming
- Closed Loop Ready: Feedback and Feedforward Capabilities
- Smart Factory solution with Real-time SPC Trends
Optical System
Imaging Method | Dynamic Imaging |
Camera | 4 Mpix |
Imaging Resolution | 10 μm, 15 µm (factory setting) |
Lighting | RGB LED |
3D Technology | 2-way Fringe Pattern |
Field of View |
4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
Inspection Performance
Imaging Speed |
4 Mpix@ 10 µm: 80 cm²/sec 4 Mpix@ 15 µm: 180 cm²/sec |
Height Resolution | 0.4 µm |
Max. Solder Height |
@ 10 µm: 420 µm @ 15 µm: 385 µm |
Motion Table & Control
X-Axis Control | Linear motor + Linear Scale + EtherCAT Servo |
Y-Axis Control | AC motor with ball screw + EtherCAT Servo |
Z-Axis Control | AC motor with ball screw + EtherCAT Servo |
X-Y Axis Resolution | 0.5 µm |
Z-Axis Resolution | 1 µm |
Board Handling
Max PCB Size |
TR7007 SII Ultra: 510 x 460 mm TR7007 SII Ultra DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 50 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor Height |
880 – 920 mm * SMEMA Compatible |
Inspection Functions
Defects |
Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement |
Height Area Volume Offset |
Dimensions
WxDxH |
TR7007 SII Ultra: 1100 x 1480 x 1600 TR7007 SII Ultra DL: 1100 x 1705 x 1600 mm Note: not including signal tower, signal tower height 512 mm |
Weight |
TR7007 SII Ultra: 740 kg TR7007 SII Ultra DL: 925 kg |