TR7007 D Plus

The TR7007 SII Ultra performs at an industry-leading speed of up to 180 cm2/sec. The TR7007 SII Ultra is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The 3D SPI is an Industry 4.0 Ready Solution supporting the upcoming and innovative protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard.

  • Industry-leading inspection speed up to 180 cm2/sec
  • Ready to Inspect in Minutes with TRI's Smart Programming
  • Closed Loop Ready: Feedback and Feedforward Capabilities
  • Smart Factory solution with Real-time SPC Trends
Optical System
Imaging Method Dynamic Imaging
Camera 4 Mpix
Imaging Resolution 10 μm, 15 µm (factory setting)
Lighting RGB LED
3D Technology 2-way Fringe Pattern
Field of View 4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm
Inspection Performance
Imaging Speed 4 Mpix@ 10 µm: 80 cm²/sec
4 Mpix@ 15 µm: 180 cm²/sec
Height Resolution 0.4 µm
Max. Solder Height @ 10 µm: 420 µm
@ 15 µm: 385 µm
Motion Table & Control
X-Axis Control Linear motor + Linear Scale + EtherCAT Servo
Y-Axis Control AC motor with ball screw + EtherCAT Servo
Z-Axis Control AC motor with ball screw + EtherCAT Servo
X-Y Axis Resolution 0.5 µm
Z-Axis Resolution 1 µm
Board Handling
Max PCB Size TR7007 SII Ultra: 510 x 460 mm
TR7007 SII Ultra DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 50 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Height 880 – 920 mm

* SMEMA Compatible
Inspection Functions
Defects Insufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
Measurement Height
WxDxH TR7007 SII Ultra: 1100 x 1480 x 1600
TR7007 SII Ultra DL: 1100 x 1705 x 1600 mm

Note: not including signal tower, signal tower height 512 mm
Weight TR7007 SII Ultra: 740 kg
TR7007 SII Ultra DL: 925 kg