TR7500 SIII 3D

TRI's optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible. Combining state-of-the-art software solution and third generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection and with high inspection coverage and easy programming.

  • High Speed Color Multi-angle Inspection of Up to 01005 Components
  • High Defect Coverage Using Hybrid 2D+3D Inspection Technology
  • True 3D Profile Measurement Using Dual Laser Units
  • Rapid Programming Interface with Auto Library and Offline Editing
Optical System
Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera 1.3 Mpix or 6.5 Mpix (factory setting)
Imaging Resolution Optical: 10 µm, 15 µm
Laser: 10 μm (optional), 20 μm, 50 μm

Note: Factory setting
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm
Inspection Performance
Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*

* Depending on board size and laser resolution
Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm
Board Handling
Max PCB Size TR7500 SIII 3D: 510 x 460 mm*
TR7500L SIII 3D: 660 x 460 mm
TR7500 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane

* The testable PCB size range will vary depending on the configuration of laser probe
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg
Top Clearance 15 mm/25 mm/48 mm [optional]

(1) Laser resolution@ 50 μm is 25 or 48 mm (optional)
(2) Laser resolution@ 20 μm is 25 mm
(3) Laser resolution@ 10 μm is 15 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Inline
Height: 880 – 920 mm

* SMEMA Compatible
Inspection Functions
Component Missing
Wrong Marking (OCV)
Upside Down
Extra Component
Foreign Material
Lifted Component
Solder Excess Solder
Insufficient Solder
Through-hole Pins
Lifted Lead
Golden Finger
WxDxH TR7500 SIII 3D: 1100 x 1670 x 1550 mm
TR7500L SIII 3D: 1300 x 1630 x 1655 mm
TR7500 SIII 3D DL: 1100 x 1770 x 1550 mm

Note: not including signal tower, signal tower height 520 mm
Weight TR7500 SIII 3D: 1010 kg
TR7500L SIII 3D: 1250 kg
TR7500 SIII 3D DL: 1150 kg