TR7500 SIII 3D
TRI's optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible. Combining state-of-the-art software solution and third generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
- High Speed Color Multi-angle Inspection of Up to 01005 Components
- High Defect Coverage Using Hybrid 2D+3D Inspection Technology
- True 3D Profile Measurement Using Dual Laser Units
- Rapid Programming Interface with Auto Library and Offline Editing
Optical System
Imaging Method | Dynamic Imaging with true 3D profile measurement |
Top Camera | 4 Mpix |
Angle Camera | 1.3 Mpix or 6.5 Mpix (factory setting) |
Imaging Resolution |
Optical: 10 µm, 15 µm Laser: 10 μm (optional), 20 μm, 50 μm Note: Factory setting |
Lighting | Multi-phase RGB+W LED |
3D Technology | Single/Dual 3D laser sensors |
Max. 3D Range | 20 mm |
Inspection Performance
Imaging Speed |
4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* * Depending on board size and laser resolution |
Motion Table & Control
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 µm |
Board Handling
Max PCB Size |
TR7500 SIII 3D: 510 x 460 mm* TR7500L SIII 3D: 660 x 460 mm TR7500 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane * The testable PCB size range will vary depending on the configuration of laser probe |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance |
15 mm/25 mm/48 mm [optional] Note: (1) Laser resolution@ 50 μm is 25 or 48 mm (optional) (2) Laser resolution@ 20 μm is 25 mm (3) Laser resolution@ 10 μm is 15 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm |
Conveyor |
Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
Component |
Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Solder |
Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
WxDxH |
TR7500 SIII 3D: 1100 x 1670 x 1550 mm TR7500L SIII 3D: 1300 x 1630 x 1655 mm TR7500 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
Weight |
TR7500 SIII 3D: 1010 kg TR7500L SIII 3D: 1250 kg TR7500 SIII 3D DL: 1150 kg |